Trelleborg Sealing Solutions introduces the newly developed Isolast® Fab Range™ J9675. This compound gives an unrivalled combination of attributes which in tests prove it to be one of the best semiconductor sealing materials overall.
Isolast® Fab Range™ J9675 from Trelleborg Sealing Solutions is a newly developed sealing compound engineered to offer excellent chemical resistance and minimal particulation across a wide range of semiconductor wafer processes. In particular, it gives enhanced performance in fluorine and oxygen-based plasma environments, while its unique curing and filler system ensures superior long-term properties in operating temperatures up to +300°C/ +572°F.
Isolast® Fab RangeTM J9675 gives enhanced performance in fluorine and oxygen-based plasma environments
Isolast® Fab Range™ J9675 demonstrates an unrivalled combination of attributes making it the best overall material in tests
Isolast® Fab Range™ J9675 has been proven through field tests and in independent laboratories in both dry and plasma semiconductor processing environments. In these the material demonstrated an unrivalled combination of attributes in terms of plasma resistance, purity, physical properties, outgassing, leach out and high temperature resistance. This meant it proved to be the best overall material in such conditions.
Results of plasma tests in NF3/O2 and SF6/O2
With Isolast® Fab Range™ J9675 no compromise is r equired
“The compound and polymer technology available up until now has meant that engineers needed to choose a material for semiconductor equipment on the basis of a single characteristic,” says Ursula Porelle, Product Manager for Isolast®. “To achieve good plasma resistance linked with low outgassing and particulation could result in sacrificing high temperature performance and physical properties, compression set especially. While to ensure the highest purity, surface energy properties were compromised. With Isolast® Fab Range™ J9675 this compromise is not required.”
Features and benefits of Isolast® Fab Range™ J9675:
- Provides a universal solution in dry process and plasma semiconductor wafer processing environments
- Especially suited to fluorine and oxygen based plasma environments
- Offers extended life in these applications
- Helps extend mean time between planned maintenance
- High purity, minimal particulation
- Very low metallic ion content
- Continuous service temperatures to +300°C / +572 °F
- Outstanding retention of long-term properties
- Available in O-Rings, square and special section seals, V-Rings®, as well as custom molded seals and engineered solutions
- Standard product finishing in Class 100 Cleanroom
Typical applications for Isolast® Fab Range™ J9675:
Deposition (CVD, PECVD, HDPCVD, RPCVD, APCVD, SACVD,DCVD), oxidation, diffusion, etching, ashing, metallization and RTP processes.
Click here to download a copy of our customer magazine 'in the groove' where you will find an article on Isolast® Fab Range™ J9675
About the Isolast® Fab Range™
Isolast® is the proprietary range of perfluoroelastomer (FFKM) materials from Trelleborg Sealing Solutions. Isolast® Fab Range™ J9675 is a compound from within the Isolast® Fab Range™ that has been specifically engineered to meet the sealing requirements of semiconductor equipment. This also includes:
Isolast® Fab Range™ J9610 provides optimum performance in wet processing environments, including wet etch, wet stripping, wet cleaning, plating, chemical mechanical planarisation (CMP) and ultra pure de-ionised water applications. Inherent capabilities enable the compound to cope with continuous operating temperatures up to 235°C / 455°F, whilst exhibiting low levels of extractable total organic carbon (TOC).
Download leaflet on Isolast® Fab Range™ J9610
Isolast® Fab Range™ J9630 is a white compound developed for all plasma and thermal processes. Exhibiting robust long-term resistance and low weight loss, it has excellent resistance to all plasma and dry process gases in continuous service temperatures to 260°C / 500°F.
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Isolast® Fab Range™ J9650 is a high temperature compound developed for high temperature wafer-processing applications, including rapid thermal processing, chemical vapour deposition (CVD), diffusion processing, dry plasma etching, dry ashing, metallization and annealing. It provides effective sealing operation up to temperatures of 320°C / 608°F.
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Isolast® Fab Range™ J9670 operates at temperatures up to 315°C / 599°F and is specifically formulated for high temperature plasma applications in wafer processing. In addition it offers superior resistance to aggressive, high temperature plasma erosion, minimal particle generation and extremely low outgassing.
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Isolast® Fab Range™ J9680 is a translucent material developed to achieve the ultimate low particle generation in plasma process environments. It is suitable for selected applications in deposition, etching, ashing and stripping processes to 230°C / 446°F.
Download leaflet on Isolast® Fab Range™ J9680
Click here to download the semiconductor brochure for more information on all sealing products for this industry