A further Perfluoroelastomer material within their Isolast® Fab Range™ has been developed by Busak+Shamban for semiconductor industry applications. Known as Isolast® J9670, the new grade of material is formulated to increase productivity through sealing efficiency and extended seal life.
With a capability of operating at temperatures up to 315°C, Isolast® J9670 has been specifically formulated for high temperature plasma applications in wafer processing. With a superior resistance to aggressive, high temperature plasma erosion, minimal particle generation and extremely low outgassing, Isolast® J9670 meets industry requirements for seals exhibiting ultra high purity, cleanliness, reliability and long life.
Isolast® J9670 is suited for operation at temperatures up to 315ºC within processes including: Dry plasma etch, oxidation, Chemical Vapour Deposition (CVD), plasma ashing, diffusion, and metalisation.
For downloadable leaflet on Isolast® Fab Range™ J9670, click here.