Isolast® Fab Range™ developed to meet stringent demands of semiconductor processing industry

Isolast® Fab Range™ developed to meet stringent demands of semiconductor processing industry

Isolast® Fab Range™ developed to meet stringent demands of semiconductor processing industry

The advanced range of Perfluoroelastomer materials, fromBusak+Shamban, known as Isolast® Fab Range™, developed to meet thestringent demands of sealing within the semiconductor processingindustry, will be the focus on their stand at SEMICON Europa.
Isolast® Fab Range™ materials are available in a wide range ofsealing profiles to precisely match semiconductor industryrequirements, including O-Rings, gaskets, custom moulded geometriesand bonded components. Common features of the Fab Range™ include:ultra high purity, extremely low metallic cation extractables,minimum anion impurities, excellent long-term compression setproperties and chemical resistance to most media.
For critical applications within semiconductor processing,Isolast® Fab Range™ Perfluoroelastomer sealing materials aremanufactured in a cleanroom environment and then cleaned and packedto class 100 standard.
New grades of materials include:
Isolast® J9610 is a unique formulation providing optimumperformance in wet processing environments, including wet etch, wetstripping, wet cleaning, plating, chemical mechanical planarisation(CMP) and ultra pure de-ionised water applications. Inherentcapabilities enable the compound to cope with continuous operatingtemperatures up to 235°C, whilst exhibiting low levels ofextractable total organic carbon (TOC).
Isolast® J9630 is a material developed for use in plasmaprocessing, exhibiting minimum particulation and extremely lowoutgassing levels. It is also resistant to aggressive plasmas anddry process gasses in continuous service temperatures up to260°C.
Isolast® J9650 is a high temperature compound developed for hightemperature wafer-processing applications, including rapid thermalprocessing, chemical vapour deposition (CVD), diffusion processing,dry plasma etching, dry ashing, metallisation and annealing. Itprovides effective sealing operation up to temperatures of320°C.
In addition, a NEW grade of material, known as Isolast® J9670,with properties specifically developed for high temperature plasmaapplications, was launched by Busak+Shamban, at SEMICONEuropa.

These material grades extend the range of products supplied byBusak+Shamban to the semiconductor industry, includingTurcon®Varilip® PDR (metal cased shaft seal), Turcon®Variseal®,Wills Rings® and standard elastomer sealing solutions.
For downloadable brochures featuring information on the Isolast®Fab Range™, please see the Download Area of the website.