Challenging wet process applications

Semiconductor wet manufacturing process steps include etching, stripping, plating and CMP (Chemical Mechanical Planarization). These are followed by wafer cleaning, removal of all surface contamination of particulates, organics, metallics and native oxides. Plus all liquids used must have extremely high purity.

These chemically intensive semiconductor processes involve wet process chemicals including acids, such as hydrofluoric, alkaline solutions like sodium hydroxide and solvents, typically N-methylpyrrolidone or acetone.

Seals with universal chemical resistance

Optimum seal performance is critical in ensuring maximum uptime throughout the ULSI (ultra large scale integration) process. Trelleborg Sealing Solutions offers semiconductor sealing materials that give almost universal chemical resistance, minimum leach out of ionic impurities and extremely low particulation in wet process applications.

Recommended semiconductor sealing materials:

Isolast® Fab Range™ J9610