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High-temperature semiconductor wafer processing and plasma applications include Rapid Thermal Processing (RTP), Chemical Vapor Deposition (CVD) and dry plasma etch.
Maximum sealing performance
Seals must withstand temperatures above 300°C / 572°F with main requirements of low outgassing and minimum particle generation. Sealing materials from Trelleborg Sealing Solutions are proven to successfully operate at continuously elevated temperatures while withstanding demanding chemicals and media.
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