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Demanding plasma systems
plasma process


Plasma is used at various stages during semiconductor wafer fabrication.


The plasma state is created when a gas is subjected to energy, breaking down its molecular integrity and dissociating it into ions and electrons. Many of the gases used to do this in semiconductor processes are toxic, reactive and pyrophoric.


Ultra-pure sealing solutions


It is essential that seals withstand this harsh plasma environment, where they will be subject to high energy and possibly elevated temperatures. Inadequate sealing can lead to contamination and affect product yield. Ultra-pure sealing solutions from Trelleborg Sealing Solutions ensure long-term reliability with minimal particulation and extremely low outgassing.


Recommended semiconductor sealing materials:

Isolast® Fab Range™ J9630

Isolast® Fab Range™ J9670

Isolast® Fab Range™ J9675


 
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Semiconductor Sealing Solutions (PDF 1905K)
Isolast® Fab Range™ J9630 - Superior sealing for aggresive plasma applications (GIF unknownK)
Isolast® Fab Range™ J9670 - Superior sealing for high temperature plasma applications (GIF unknownK)
Isolast® Fab Range™ J9675 - Universal Sealing in Dry/Plasma Wafer Processes (PDF 145K)